QianLi iCopy-S Double-sided Baseband Module For iPhone 6-XS MAX Phone Screen Replacement AIFEN 861DW 700W BGA rework

AIFEN 861DW 700W BGA rework station hot air gun micro-soldering tool for mobile phone electronic BGA motherboard ECU IC soldering desoldering repair

Stability: ±1°C

Communication connector: USB-A / USB-B / Pedal

The unit displays Celsius "℃" Fahrenheit "℉"

QianLi iCopy-S Double-sided Baseband Module For iPhone 6-XS MAX Phone Screen Replacement AIFEN 861DW 700W BGA reworkQianli iCopy S 4 in 1 double side chip test frame for iPhone 6 6P 6S 6SP 7 7P 8 8P X XS MAX XR motherboard repair tool, ToolPlus QianLi iCopy S 4 in 1 test fixture non removal module for iPhone 6 6P 6S 6SP 7 7P 8 8P X XR XS MAX logic baseband EEPROM chip, iCopy S 4 in 1 non removal module for read, write program logic chip, Intel, and Qualcomm baseband chip. QianLi iCopy S 4 IN 1 Double sided Logic Baseband EEPROM Chip Non removal Module For iPhone 6