WL BGA Reballing Stencil Kit With Positioning Mold For iPhone X-12promax Cleaning Tool Packing Size: 370*220*170 mm

Packing Size: 370*220*170 mm

ready to use

accurate and stable temperature

Huawei FIG-TL10 [Huawei Figo]

WL BGA Reballing Stencil Kit With Positioning Mold For iPhone X-12promax Cleaning Tool Packing Size: 370*220*170 mmWL high accuracy BGA Reballing Stencil template for iphone 5S 6 6S 7 8 X XS MAX 11,11Pro,11 Pro Max,12,12Pro,12 Pro Max NAND and Baseband Soldering Repair, WL High Quality BGA Reballing Stencils kit come with Black Positioning Mold, WL High Quality Soldering BGA Reballing Stencil With Fixed Plate. Specifications: Material: High end Imported Steel Mesh Color: As Picture Shows Type: High Precision Ball Planting Net Model Number: WL High Quality Tin