XZZ AR SAM Middle Layer Reballing Platform for S21/S22/S23/S24/S25 Ultra Option:S20+ mold+stencil Weight: 956g

Name: XZZ AR SAM Middle Layer Reballing Platform for S21/S22/S23/S24/S25 Ultra Option:S20+ mold+stencil Weight: 956g
Brand: www.casadeararas.com.br
SKU: 58437705837
Price: 101.50 USD
Availability: InStock
Rating: 4.876600000000001 (23 reviews)

SKU: 58437705837

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Ships within 48 hours · Estimated delivery Aug 31 - Sep 5

Description

Weight: 956g

thickened base

ZTE (Qualcomm)

Sturdy all-metal table standdesign for 3-Degree Freedom

XZZ AR SAM Middle Layer Reballing Platform for S21/S22/S23/S24/S25 Ultra Option:S20+ mold+stencil Weight: 956gXZZ AR Series SAM Motherboard Middle Layer Planting Tin Platform for Samsung S20 S26 Ultra. XINZHIZAO XZZ Samsung motherboard reballing platform with C6 magnetic base, S20 S25, S20 Plus S25+, S20 Ultra S26U positioning platform and mid layer stencil for Samsung motherboard soldering repair. Models: S20 Ultra, S21 Ultra, S22 Ultra, S23 Ultra, S24 Ultra, S25 Ultra, S26 Ultra positioning platform with mid layer stencil. S20, S21, S22, S23, S24, S25

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