YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine Energy: 60S/120S/180S≈600J/1200J/2000J

Energy: 60S/120S/180S≈600J/1200J/2000J

Tester: The Mechanic Sherlock V2

welding and send tin integration efforts temperature can be set between 200-500 degrees from the thermostat can be quickly replaced and automatically welded tin

Lens: HD microscope lens

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine Energy: 60S/120S/180S≈600J/1200J/2000JYCS MR. YANG BGA Reballing Stencil with Platform Kit for iPhone X 17 Pro Max middle layer and A11 A19 Pro CPU soldering repair. The reballing soldering kit includes various stencils designed for replacing and resoldering different circuit boards. It safely and effectively resolders iPhone CPU or mid frame solder joints, helping to repair iPhone malfunctions caused by solder joint issues. The BGA reballing platform kit supports repairs of mid layer