MIJING TC-10 Ceramic Knife Suit Carving Blade IC Glue Removal Option:MIJING TC-10 AC: 50 / 60Hz

AC: 50 / 60Hz

Size: 110 mm(L) * 38 mm(DIA)

8-12mm/5-50mm varifocal lens

you need to repeat the disassembly and reassembly operation

MIJING TC-10 Ceramic Knife Suit Carving Blade IC Glue Removal Option:MIJING TC-10 AC: 50 / 60HzMIJING TC 10 Ceramic Knife Suit 3 in 1 knife handle with blade for mobile phone nand chip IC glue removal. ceramic blade carving knife non slip knife suitable for mobile phone laptop PCB repair and motherboard dot matrix camera disassembly and repair. Features: 1. Thin blade, high temperature resistance, can withstand up to 1000 degrees, compatible with black glue removal and high temperature cutting. 2. Remove IC and pad black glue, pry open CPU IC