MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZW25 0.76mm Simply unpack this soldering iron

Simply unpack this soldering iron and connect it to a mains socket

XP (32Bit + 64Bit)

Interface Specification :

Packing Size: 360×230×360mm

MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZW25 0.76mm Simply unpack this soldering ironMECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools MECHANIC solder ball 25000PCS Bottle Notice: XZ25 is Lead solder ball, XZW25 is Lead free Solder ball. The BGA solder ball has the following characteristics: Meet EU ROHS and REACH standards. With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. Purity and sphericity are very high,