TBK-2208 BGA X-Ray Machine for Non-Destructive PCB IC Inspection DC Power Supply The double-sided internal SMT manufacturing

The double-sided internal SMT manufacturing process boasts clean craftsmanship

Dimensions: 424MMX328MMX250MM

Mechanic LM3 Double Aram Bracket

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TBK-2208 BGA X-Ray Machine for Non-Destructive PCB IC Inspection DC Power Supply The double-sided internal SMT manufacturingTBK 2208 Desktop X Ray Machine Chip Detector for non destructive inspection of electronic components including mobile phone motherboards, BGA, PCBs, and ICs. TBK 2208 X ray Machine allows for detailed analysis of BGA solder joints, IC chips, and other components to accurately identify defects such as voids, bridging, and cold solder without damaging the part. Features: 1. Integrated Safety Shielding: The unit utilizes an integrated, high density,