FW-HA01/02/03/04/05 Spiral Wind Hot Air Desoldering Station Option:FW-HA01 Weight: Net: 528

Weight: Net: 528

Selectable temperature from 50°C to 480°C

Vacuum lamination for bonding with glass cover plate

Wide jaw pads pivot to fit work piece for a uniform grip on uneven surfaces

FW-HA01/02/03/04/05 Spiral Wind Hot Air Desoldering Station Option:FW-HA01 Weight: Net: 528FORWARD FW HA01 FW HA02 FW HA03 FW HA04 FW HA05 Helical Wind Desoldering Station 800W Hot Air Gun with Nozzles for mobile phone motherboard and electronic PCB CPU BGA soldering repair. Fast heating, precise temperature control, efficient airflow, temperature calibration, high definition LCD display. The most commonly used tool in mobile phone repair. Features: 1. High precision temperature control Using advanced temperature control technology, the