LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope the lead-free soldering iron tip

the lead-free soldering iron tip has fast heat conduction

easy to use and convenient

Brightness

vacuum time

LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope the lead-free soldering iron tipLuowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc. Features: 1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient